| Impedance matching of traces and multilayer via transitions for on-package links G Hernandez-Sosa, R Torres-Torres, A Sanchez IEEE Microwave and wireless components letters 21 (11), 595-597, 2011 | 25 | 2011 |
| Characterization of electrical transitions using transmission line measurements R Torres-Torres, G Hernández-Sosa, G Romo, A Sánchez IEEE Transactions on Advanced Packaging 32 (1), 45-52, 2009 | 19 | 2009 |
| Return-loss minimization of package interconnects through input space mapping using FEM-based models JC Cervantes-González, CA López, JE Rayas-Sánchez, Z Brito-Brito, ... 2013 SBMO/IEEE MTT-S International Microwave & Optoelectronics Conference …, 2013 | 9 | 2013 |
| Scalable models to represent the via-pad capacitance and via-traces inductance in multilayer PCB high-speed interconnects A Isidoro-Muñoz, R Torres-Torres, MA Tlaxcalteco-Matus, ... 2017 International Caribbean Conference on Devices, Circuits and Systems …, 2017 | 7 | 2017 |
| Characterization and modeling of electronic packages using S-parameters G Hernandez-Sosa, G Romo, R Torres-Torres 2008 7th International Caribbean Conference on Devices, Circuits and Systems …, 2008 | 7 | 2008 |
| Measuring bit error rate during runtime of a receiver circuit GH Sosa, V Kollia US Patent 9,264,187, 2016 | 5 | 2016 |
| Intel Labs Mexico-Leading Industrial Research in Latin America JR Camacho-Perez, G Hernandez-Sosa, A Alcocer-Ochoa, CA Lopez, ... 2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-3, 2014 | 4 | 2014 |
| Analytical modeling of differential launch structures for RF measurements and characterization purposes MA Tlaxcalteco-Matus, D García-Mora, R Torres-Torres, ... 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI), 1-4, 2014 | 3 | 2014 |
| Analytical calculation of the equivalent inductance for signal vias in parallel planes with arbitrary P/G via distribution G Hernandez-Sosa, A Sanchez 2012 8th International Caribbean Conference on Devices, Circuits and Systems …, 2012 | 3 | 2012 |
| Reducing glitches when reconstructing four‐port S‐parameters of differential transmission lines from two‐port measurements DM García‐Mora, MA Tlaxcalteco‐Matus, R Torres‐Torres, ... Microwave And Optical Technology Letters 56 (10), 2257-2260, 2014 | 2 | 2014 |
| Return loss and crosstalk mitigation in coupled vias for modern high‐speed packaging G Hernandez‐Sosa, R Torres‐Torres, A Sanchez International Journal of RF and Microwave Computer‐Aided Engineering 22 (2 …, 2012 | 2 | 2012 |
| High speed differential pinout arrangement including a power pin RE Shibayama, CAL Moreno, GH SOSA, K Xiao US Patent App. 16/902,832, 2021 | 1 | 2021 |
| Structural optimization of contact geometry for high-performance connector BTL Se-Jung Moon, Chien-Ping Kao, Gaudencio Hernandez Sosa US Patent App. 16/857,833, 2021 | 1* | 2021 |
| Electrical modeling and optimization of multilayer via transitions for fully-integrated systems GH Sosa Doktora Tezi, National Institute for Astrophysics, Optics and Electronics …, 2011 | 1 | 2011 |
| Characterization and modeling of complex chip-to-chip interconnection channels on printed circuit boards using high-frequency techniques G Hernández-Sosa Intel, 2008 | 1 | 2008 |
| Electrical routing component layout for crosstalk reduction RE Shibayama, V Boddu, LNP ACOSTA, FJG MEDINA, K Xiao, ... US Patent App. 16/128,284, 2020 | | 2020 |
| Electromagnetic Domain Decomposition for Through-Hole Mounting Connectors Models G Hernandez-Sosa, S Moon, X Ye 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | | 2019 |
