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Brian S. Holsclaw
Brian S. Holsclaw
Corning Inc, Hemlock Semiconductor, Carnegie Mellon University
Dirección de correo verificada de corning.com
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Superenantioselective chiral surface explosions
AJ Gellman, Y Huang, X Feng, VV Pushkarev, B Holsclaw, BS Mhatre
Journal of the American Chemical Society 135 (51), 19208-19214, 2013
742013
A window on surface explosions: tartaric acid on Cu (110)
BS Mhatre, V Pushkarev, B Holsclaw, TJ Lawton, ECH Sykes, AJ Gellman
The Journal of Physical Chemistry C 117 (15), 7577-7588, 2013
462013
Surface structure spread single crystals (S4C): preparation and characterization
A De Alwis, B Holsclaw, VV Pushkarev, A Reinicker, TJ Lawton, ...
Surface science 608, 80-87, 2013
252013
Adsorption site distributions on Cu (111), Cu (221), and Cu (643) as determined by Xe adsorption
L Baker, B Holsclaw, AE Baber, HL Tierney, ECH Sykes, AJ Gellman
The Journal of Physical Chemistry C 114 (43), 18566-18575, 2010
142010
Xe adsorption site distributions on Pt (111), Pt (221) and Pt (531)
AJ Gellman, L Baker, BS Holsclaw
Surface Science 646, 83-89, 2016
52016
Structure Sensitivity in Enantioselective Surface Chemistry: Tartaric Acid on Copper (110) and Copper (651)(Power of R&S)
BS Holsclaw
Carnegie Mellon University, 2012
42012
Controlled Crystallinity of Silicon Powders
BS Holsclaw, MJ Molnar, W Herron, JP McDonald, MA Gave, JJ Host
Silicon for the Chemical and Solar Industry XII, 167-176, 2014
22014
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