| Wire arc additive manufacturing of stainless steels: a review W Jin, C Zhang, S Jin, Y Tian, D Wellmann, W Liu Applied sciences 10 (5), 1563, 2020 | 253 | 2020 |
| A comparative study on microstructure and properties of traditional laser cladding and high-speed laser cladding of Ni45 alloy coatings W Yuan, R Li, Z Chen, J Gu, Y Tian Surface and Coatings Technology 405, 126582, 2021 | 199 | 2021 |
| A review on laser powder bed fusion of inconel 625 nickel-based alloy Z Tian, C Zhang, D Wang, W Liu, X Fang, D Wellmann, Y Zhao, Y Tian Applied Sciences 10 (1), 81, 2019 | 156 | 2019 |
| Additive manufacturing of WC-Co hardmetals: a review Y Yang, C Zhang, D Wang, L Nie, D Wellmann, Y Tian The International Journal of Advanced Manufacturing Technology 108 (5), 1653 …, 2020 | 119 | 2020 |
| Effect of processing parameters on the densification, microstructure and crystallographic texture during the laser powder bed fusion of pure tungsten AT Sidambe, Y Tian, PB Prangnell, P Fox International Journal of Refractory Metals and Hard Materials 78, 254-263, 2019 | 101 | 2019 |
| Material interactions in laser polishing powder bed additive manufactured Ti6Al4V components Y Tian, WS Gora, AP Cabo, LL Parimi, DP Hand, S Tammas-Williams, ... Additive Manufacturing 20, 11-22, 2018 | 101 | 2018 |
| Laser powder bed fusion of precipitation-hardened martensitic stainless steels: a review L Zai, C Zhang, Y Wang, W Guo, D Wellmann, X Tong, Y Tian Metals 10 (2), 255, 2020 | 100 | 2020 |
| A review on additive manufacturing of pure copper Q Jiang, P Zhang, Z Yu, H Shi, D Wu, H Yan, X Ye, Q Lu, Y Tian Coatings 11 (6), 740, 2021 | 99 | 2021 |
| Enhancing surface finish of additively manufactured titanium and cobalt chrome elements using laser based finishing WS Gora, Y Tian, AP Cabo, M Ardron, RRJ Maier, P Prangnell, NJ Weston, ... Physics Procedia 83, 258-263, 2016 | 96 | 2016 |
| Investigation of the phase transformations in Ti-22Al-25Nb alloy DS Bin Shao, Yingying Zong, Daosheng Wen, Yingtao Tian Materials Characterization 114, 75-78, 2016 | 76 | 2016 |
| Selective laser melted AlSi10Mg alloy under melting mode transition: Microstructure evolution, nanomechanical behaviors and tensile properties H Wu, Y Ren, J Ren, L Liang, R Li, Q Fang, A Cai, Q Shan, Y Tian, I Baker Journal of Alloys and Compounds 873, 159823, 2021 | 72 | 2021 |
| Micromachined thick mesh filters for millimeter-wave and terahertz applications Y Wang, B Yang, Y Tian, RS Donnan, MJ Lancaster IEEE Transactions on Terahertz Science and Technology 4 (2), 247-253, 2014 | 61 | 2014 |
| Friction stir spot welding of aluminum and copper: a review M Li, C Zhang, D Wang, L Zhou, D Wellmann, Y Tian Materials 13 (1), 156, 2019 | 59 | 2019 |
| A SU8 micromachined WR-1.5 band waveguide filter X Shang, Y Tian, MJ Lancaster, S Singh IEEE microwave and wireless components letters 23 (6), 300-302, 2013 | 57 | 2013 |
| A micromachined dual-band orthomode transducer CA Leal-Sevillano, Y Tian, MJ Lancaster, JA Ruiz-Cruz, JR Montejo-Garai, ... IEEE transactions on microwave theory and techniques 62 (1), 55-63, 2013 | 48 | 2013 |
| A review on the effect of laser pulse shaping on the microstructure and hot cracking behavior in the welding of alloys P Zhang, Z Jia, Z Yu, H Shi, S Li, D Wu, H Yan, X Ye, J Chen, F Wang, ... Optics & Laser Technology 140, 107094, 2021 | 44 | 2021 |
| Research on weld formation mechanism of laser-MIG arc hybrid welding with butt gap H Huang, P Zhang, H Yan, Z Liu, Z Yu, D Wu, H Shi, Y Tian Optics & Laser Technology 133, 106530, 2021 | 44 | 2021 |
| Process parameter optimization for selective laser melting of Inconel 718 superalloy and the effects of subsequent heat treatment on the microstructural evolution and … W Wang, S Wang, X Zhang, F Chen, Y Xu, Y Tian Journal of Manufacturing Processes 64, 530-543, 2021 | 41 | 2021 |
| Process optimization of dual-laser beam welding of advanced Al-Li alloys through hot cracking susceptibility modeling Y Tian, JD Robson, S Riekehr, N Kashaev, L Wang, T Lowe, A Karanika Metallurgical and Materials Transactions A 47, 3533-3544, 2016 | 40 | 2016 |
| Electrodeposition of indium for bump bonding Y Tian, C Liu, D Hutt, B Stevens 2008 58th Electronic Components and Technology Conference, 2096-2100, 2008 | 38 | 2008 |
