Key components of modular propulsion systems for next generation electric vehicles A Stippich, CH Van Der Broeck, A Sewergin, AH Wienhausen, M Neubert, ... CPSS Transactions on Power Electronics and Applications 2 (4), 249-258, 2017 | 150 | 2017 |
Design challenges of SiC devices for low-and medium-voltage DC-DC converters G Engelmann, A Sewergin, M Neubert, RW De Doncker IEEJ Journal of Industry Applications 8 (3), 505-511, 2019 | 64 | 2019 |
Modular bidirectional full-SiC DC-DC converter for automotive applications A Sewergin, AH Wienhausen, K Oberdieck, RW De Doncker 2017 IEEE 12th International Conference on Power Electronics and Drive …, 2017 | 55 | 2017 |
Highly integrated two-phase SiC boost converter with 3D-printed fluid coolers and 3D-printed inductor bobbins AH Wienhausen, A Sewergin, RW De Doncker PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 27 | 2018 |
Highly efficient power inductors for high-frequency wide-bandgap power converters AH Wienhausen, A Sewergin, SP Engel, RW De Doncker 2017 IEEE 12th International Conference on Power Electronics and Drive …, 2017 | 27 | 2017 |
From ac to dc: Benefits in household appliances A Stippich, A Sewergin, G Engelmann, J Gottschlich, M Neubert, ... International ETG Congress 2017, 1-6, 2017 | 22 | 2017 |
Influence of the voltage-dependent output capacitance of SiC semiconductors on the electromagnetic interference in DC-DC converters for electric vehicles K Oberdieck, A Sewergin, RW De Doncker 2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-6, 2017 | 17 | 2017 |
Ultra-high power density full-SiC boost converter enabled by advanced 3D-printing techniques AH Wienhausen, A Sewergin, RW De Doncker 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1281-1288, 2019 | 15 | 2019 |
Significance of thermal cross-coupling effects in power semiconductor modules A Stippich, M Neubert, A Sewergin, RW De Doncker 2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC), 1-6, 2016 | 13 | 2016 |
A highly-integrated SiC power module for fast switching DC-DC converters A Stippich, T Kamp, A Sewergin, L Fraeger, AH Wienhausen, D Bündgen, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 5329-5336, 2019 | 10 | 2019 |
Control hardware and suitable current sensors for fast switching sic dc-dc converters A Sewergin, AH Wienhausen, S Blasius, RW De Doncker PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 10 | 2019 |
Comparison of high performance cooling concepts for SiC power modules A Sewergin, A Stippich, AHWRW De 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2822-2825, 2019 | 8 | 2019 |
Electromagnetic emissions by three different concepts of bidirectional multi-phase SiC DC-DC boost converters K Oberdieck, AH Wienhausen, A Sewergin, A Stippich, J Henn, ... PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 7 | 2019 |
Design of a high-frequency DC-DC converter with a custom power module and integrated cooling structures A Stippich, L Fraeger, A Sewergin, T Kamp, RW De Doncker PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 5 | 2019 |
Design challenges and solutions for the practical application of SiC power modules: exemplified by an automotive dc-dc converter A Sewergin Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2021, 2021 | 4 | 2021 |
Cascaded control of high-frequency bidirectional multi-phase boost converters implemented on low-cost FPGA A Sewergin, AH Wienhausen, CH van der Broeck, RW De Doncker PCIM Asia 2020; International Exhibition and Conference for Power …, 2020 | 4 | 2020 |
Highly Integrated Boost Converter featuring a Power Density of 98 kW/dm3 and 56 kW/kg AH Wienhausen, A Sewergin, RW De Doncker PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020 | 3 | 2020 |
Influence of current sensing equipment and dc-link capacitor on the performance of a low inductive sic switching cell A Sewergin, S Delhey, D Buendgen, A Stippich, RW De Doncker PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020 | 3 | 2020 |
Highly integrated switching cell design based on copper diamond heat spreader, 3d printed heat sink and htcc logic board A Sewergin, M Rittner, A Burghardt, K Kriegel, G Mitic, T Zetterer, T Hutsch, ... CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 3 | 2020 |
Cascode arrangement and semiconductor module J Goeppert, K Oberdieck, M Riefer, N Davies, A Sewergin, P Mueller US Patent App. 18/329,550, 2024 | | 2024 |